Polymer TSV fabrication scheme with its electrical and reliability test vehicle

Shih Wei Lee, Jian Yu Shih, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Kuo Hua Chen, Chi Tsung Chiu, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages282-285
Number of pages4
ISBN (Electronic)9781479977277
DOIs
StatePublished - 24 Feb 2015
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
Duration: 22 Oct 201424 Oct 2014

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Conference

Conference9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan
CityTaipei
Period22/10/1424/10/14

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