Polymer-based liner TSV fabrication scheme and its resistance variation

Shih Wei Lee, Jian Yu Shih, Kuo Hua Chen, Chi Tsung Chiu, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, a process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. By using ring trench etching and BCB deposition in a vacuum environment, uniform BCB liner can be successfully fabricated. Electrical measurement by using Kelvin structure is completed to ensure the performance of fabrication. However, a new phenomenon causing tiny resistance changes with the arrangement of TSV is discovered during the measurement of TSV chain. In this research, this effect is discussed in detail by designing different design of experiment (DOE) to pursue good electrical connection and reduce the variance of delay property of each TSV. Based on statistical results, impacts of TSV manufacturing process variance are discussed and the guideline in high density TSV design is found.

Original languageEnglish
Pages (from-to)4712-4715
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Volume17
Issue number7
DOIs
StatePublished - 1 Jan 2017

Keywords

  • 3D IC
  • Polymer-based liner TSV
  • Resistance variation

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