Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2

Shih Cheng Chou, Wei An Chung, Tzu Ling Fan, Yezdi Dordi, Junichi Koike, Pu Wei Wu*

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

We explore dopamine (DA) and its mixtures with polyethylene glycol (PEG) or polyethylenimine (PEI) as an adhesion layer for bonding between Cu and SiO2. The DA is oxidized to form polydopamine (PDA) which deposits as aggregates on SiO2 surface with notable surface roughness. After mixing with PEG or PEI, the morphology of PDA aggregates is altered considerably. Electroless Cu deposition in a mild alkaline bath is employed to deposit Cu atop the adhesion layer. The Cu films reveal an fcc lattice with (111) preferred orientation and their thickness was around 650 nm. From measurements of four-point probe, breaking strength, and tape-peeling tests, the PDA/PEG mixture reveals impressive performance serving as a strong adhesive for robust Cu bonding. We attribute the unique adhesive ability of PDA/PEG to the hydrogen bonds established between the catechol and amine groups of DA with PEG that renders desirable film formation on the SiO2 surface for optimized interaction between Cu and SiO2.

Original languageEnglish
Article number042507
JournalJournal of the Electrochemical Society
Volume167
Issue number4
DOIs
StatePublished - 9 Mar 2020

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