Physics and materials challenges for lead-free solders

King-Ning Tu; A. M. Gusak; M. Li

doi:10.1063/1.1517165

Physics and materials challenges for lead-free solders

King-Ning Tu^*, A. M. Gusak, M. Li

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Review article › peer-review

326 Scopus citations

Abstract

The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished.

Original language	English
Pages (from-to)	1335-1353
Number of pages	19
Journal	Journal of Applied Physics
Volume	93
Issue number	3
DOIs	https://doi.org/10.1063/1.1517165
State	Published - 1 Feb 2003

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