Abstract
The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished.
Original language | English |
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Pages (from-to) | 1335-1353 |
Number of pages | 19 |
Journal | Journal of Applied Physics |
Volume | 93 |
Issue number | 3 |
DOIs | |
State | Published - 1 Feb 2003 |