Phone-nomenon: A system-level thermal simulator for handheld devices

Hong Wen Chiou, Yu-Min Lee, Shin Yu Shiau, Chi Wen Pan, Tai Yu Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3.58% maximum error and 1.72°C difference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.

Original languageEnglish
Title of host publicationASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages577-584
Number of pages8
ISBN (Electronic)9781450360074
DOIs
StatePublished - 21 Jan 2019
Event24th Asia and South Pacific Design Automation Conference, ASPDAC 2019 - Tokyo, Japan
Duration: 21 Jan 201924 Jan 2019

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
CountryJapan
CityTokyo
Period21/01/1924/01/19

Fingerprint Dive into the research topics of 'Phone-nomenon: A system-level thermal simulator for handheld devices'. Together they form a unique fingerprint.

Cite this