Performance enhancement of flip-chip packaged AlGaN/GaN HEMTs using active-region bumps-induced piezoelectric effect

Szu Ping Tsai, Heng-Tung Hsu, Che Yang Chiang, Yung Yi Tu, Chia Hua Chang, Ting En Hsieh, Huan Chung Wang, Shih Chien Liu, Edward Yi Chang

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Chemical Compounds

Engineering & Materials Science