Patterning of self-assembly surfactant templated nanoporous silica thin film as an ultra low-k dielectric

A. T. Cho, Fu-Ming Pan, C. W. Yen, J. Y. Chen, Y. J. Chen, K. J. Chao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We have studied dry etching characteristics of the the nanoporous silica dielectric using Ar/CHF/3//CF/sub 4/ as the plasma gas source. Trimethylsilylation by hexamethyldisilazane (HMDS) vapor treatment is used to improve hydrophobicity of nanoporous silica dielectrics. During dry etch and resist ashing, hydrophobicity of the nanoporous silica thin films is destroyed, leading to serious degradation in the dielectric property.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages262-263
Number of pages2
ISBN (Electronic)4891140402, 9784891140403
DOIs
StatePublished - 1 Jan 2003
EventInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
Duration: 29 Oct 200331 Oct 2003

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Conference

ConferenceInternational Microprocesses and Nanotechnology Conference, MNC 2003
CountryJapan
CityTokyo
Period29/10/0331/10/03

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    Cho, A. T., Pan, F-M., Yen, C. W., Chen, J. Y., Chen, Y. J., & Chao, K. J. (2003). Patterning of self-assembly surfactant templated nanoporous silica thin film as an ultra low-k dielectric. In Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 (pp. 262-263). [1268746] (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2003.1268746