Packaging effect on the flow separation of CMOS thermoresistive micro calorimetric flow sensors

Wei Xu, Bo Gao, Yi Kuen Lee, Yi Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

We systematically study the packaging effect on the performance of CMOS Thermoresistive Micro Calorimetric Flow (TMCF) sensors, including two types of sensor packaging designs: S-type and E-type. For S-type design, the experimental results indicate that not only the sensitivity of TMCF sensors was significantly changed by more than 30%, but also the flow range compared to the E-type design was dramatically reduced from 0 - 11 m/s to 0 - 4.5 m/s. Comprehensive CFD simulations and the concise heater transfer analysis were performed to understand the physics behind these two different designs. Accordingly, a flow regime map (the protrusion vs the reduced Reynolds number) was constructed, where the critical boundary curve for the flow separation of CMOS TMCF sensors was determined. This flow regime map is a useful guideline for designing a well packaged flow sensor system.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages62-65
Number of pages4
ISBN (Electronic)9781509019472
DOIs
StatePublished - 28 Nov 2016
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 17 Apr 201620 Apr 2016

Publication series

Name2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Conference

Conference11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
CountryJapan
CitySendai
Period17/04/1620/04/16

Keywords

  • CFD Simulation
  • CMOS MEMS
  • Flow Regime Map
  • Flow Seperation
  • Micro Calorimetric Flow Sensors

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    Xu, W., Gao, B., Lee, Y. K., & Chiu, Y. (2016). Packaging effect on the flow separation of CMOS thermoresistive micro calorimetric flow sensors. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 (pp. 62-65). [7758201] (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2016.7758201