Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design

Chao Hung Lu*, Hung-Ming Chen, Chien-Nan Liu, Wen Yu Shih

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations affect the performance of the chip and the package significantly. In this paper, we have developed techniques in chip-package codesign to decide the locations of fingers/pads for package routability and signal integrity concerns in chip core design. Our finger/pad assignment is a two-step method: first we optimize the wire congestion problem in package routing, and then we try to minimize the IR-drop violation with finger/pad solution refinement. The experimental results are encouraging. Compared with the randomly optimized methods, our approaches reduce in average 42% and 68% of the maximum density in package and 10.61% of IR-drop for test circuits.

Original languageEnglish
Title of host publicationProceedings - 2009 Design, Automation and Test in Europe Conference and Exhibition, DATE '09
Pages845-850
Number of pages6
DOIs
StatePublished - 22 Oct 2009
Event2009 Design, Automation and Test in Europe Conference and Exhibition, DATE '09 - Nice, France
Duration: 20 Apr 200924 Apr 2009

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Conference

Conference2009 Design, Automation and Test in Europe Conference and Exhibition, DATE '09
CountryFrance
CityNice
Period20/04/0924/04/09

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  • Cite this

    Lu, C. H., Chen, H-M., Liu, C-N., & Shih, W. Y. (2009). Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design. In Proceedings - 2009 Design, Automation and Test in Europe Conference and Exhibition, DATE '09 (pp. 845-850). [5090780] (Proceedings -Design, Automation and Test in Europe, DATE). https://doi.org/10.1109/DATE.2009.5090780