Optimizing cycle time average and variation for a wafer fabrication factory with a dynamic dispatching rule

Hsin Chieh Wu*, Tin-Chih Chen, Yu Cheng Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

A dynamic dispatching rule is proposed in the present work to improve the performance of reducing the average cycle time and cycle time variation in a wafer fabrication factory. The dynamic dispatching rule is an extension from the four-factor bi-objective nonlinear fluctuation smoothing rule (4f-biNFS) by dynamically adjusting the factors in 4f-biNFS in a Pareto optimization manner. In addition, the radical transition among successive rules is smoothed by circulating rules of the same type through their weighted geometric mean as an intermediary rule. We have also investigated some theoretical properties of the dynamic dispatching rule. Through validating the effectiveness of the dynamic dispatching rule with a simulated case, some evidences were found to support its effectiveness, from which we also derived several directions that can be exploited in the future.

Original languageEnglish
Pages (from-to)400-406
Number of pages7
JournalInternational Review on Computers and Software
Volume6
Issue number3
StatePublished - 1 May 2011

Keywords

  • Dispatching rule
  • Dynamic
  • Fluctuation smoothing
  • Wafer fabrication

Fingerprint Dive into the research topics of 'Optimizing cycle time average and variation for a wafer fabrication factory with a dynamic dispatching rule'. Together they form a unique fingerprint.

Cite this