Optimized thermal management from a chip to a heat sink for high-power GaN-based light-emitting diodes

Ray-Hua Horng*, Jhih Sin Hong, Yu Li Tsai, Dong Sing Wuu, Chih Ming Chen, Chia Ju Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

45 Scopus citations

Abstract

To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit board (MCPCB), where the conventional dielectric layer was replaced with a thin diamond-like layer. Characterization results demonstrate that the diamond-added composite solder is useful in reducing LED thermal resistance, thus avoiding the thermal accumulation phenomenon. In addition, a LED packaged on the new MCPCB exhibits smaller total thermal resistance and larger light output power.

Original languageEnglish
Article number5512606
Pages (from-to)2203-2207
Number of pages5
JournalIEEE Transactions on Electron Devices
Volume57
Issue number9
DOIs
StatePublished - 1 Sep 2010

Keywords

  • Composite solder
  • light-emitting diodes (LEDs)
  • thermal resistance

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