Optimal wafer probe testing and diagnosis of k-out-of-n structures

Ming-Feng Chang*, Weiping Shi, W. Kent Fuchs

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The authors investigate wafer probing strategies for the diagnosis of repairable VLSI and WSI (wafer scale integration) structures based on integrated diagnosis and repair. Knowledge of the repair strategy, the probability of each unit being good, and the expected test time of each unit are used by the diagnosis algorithm to select units for wafer probe testing. The general problem is described followed by an examination of a specific case. Wafer probe diagnosis of k-out-of-n systems is analyzed and optimal diagnosis algorithms are derived. A compact representation of the optimal diagnosis scheme which needs O(n 2 ) space and can be generated in O(n 2 ) time is described.

Original languageEnglish
Title of host publicationIEEE Int Conf Comput Aided Des ICCAD 89 Dig Tech Pap
Editors Anon
PublisherPubl by IEEE
Pages238-241
Number of pages4
ISBN (Print)0818659866
DOIs
StatePublished - 1 Dec 1989
EventIEEE International Conference on Computer-Aided Design (ICCAD-89): Digest of Technical Papers - Santa Clara, CA, USA
Duration: 5 Nov 19899 Nov 1989

Publication series

NameIEEE Int Conf Comput Aided Des ICCAD 89 Dig Tech Pap

Conference

ConferenceIEEE International Conference on Computer-Aided Design (ICCAD-89): Digest of Technical Papers
CitySanta Clara, CA, USA
Period5/11/899/11/89

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