On thermal effects in deep sub-micron VLSI interconnects

Kaustav Banerjee*, Amit Mehrotra, Alberto Sangiovanni-Vincentelli, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

117 Scopus citations

Abstract

This paper presents a comprehensive analysis of the thermal effects in advanced high performance interconnect systems arising due to self-heating under various circuit conditions, including electrostatic discharge. Technology (Cu, low-k etc) and scaling effects on the thermal characteristics of the interconnects, and on their electromigration reliability has been analyzed simultaneously, which will have important implications for providing robust and aggressive deep sub-micron interconnect design guidelines. Furthermore, the impact of these thermal effects on the design (driver sizing) and optimization of the interconnect length between repeaters at the upper-level signal lines are investigated.

Original languageEnglish
Pages (from-to)885-891
Number of pages7
JournalProceedings - Design Automation Conference
DOIs
StatePublished - 1 Jan 1999
EventProceedings of the 1999 36th Annual Design Automation Conference (DAC) - New Orleans, LA, USA
Duration: 21 Jun 199925 Jun 1999

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