On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages

Jyun Ru Jiang, Yun Chih Kuo, Simon Yi Hung Chen, Hung Ming Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In modern package design, the bumps often place irregularly due to the macros varied in sizes and positions. This will make pre-assignment routing more difficult, even with massive design efforts. This work presents a 2-stage routing method which can be applied to an arbitrary bump placement on 2-layer BGA packages. Our approach combines escape routing with via assignment: the escape routing is used to handle the irregular bumps and the via assignment is applied for improving the wire congestion and total wirelength of global routing. Experimental results based on industrial cases show that our methodology can solve the routing efficiently, and we have achieved 82% improvement on wire congestion with 5% wirelength increase compared with conventional regular treatments.

Original languageEnglish
Title of host publicationProceedings of the 2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020
EditorsGiorgio Di Natale, Cristiana Bolchini, Elena-Ioana Vatajelu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1311-1314
Number of pages4
ISBN (Electronic)9783981926347
DOIs
StatePublished - Mar 2020
Event2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020 - Grenoble, France
Duration: 9 Mar 202013 Mar 2020

Publication series

NameProceedings of the 2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020

Conference

Conference2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020
CountryFrance
CityGrenoble
Period9/03/2013/03/20

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