On effective flip-chip routing via pseudo single redistribution layer

Hsin Wu Hsu*, Meng Ling Chen, Hung-Ming Chen, Hung Chun Li, Shi Hao Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Due to the advantage of flip-chip design in power distribution but controversial peripheral IO placement in lower design cost, redistribution layer (RDL) is usually used for such interconnection. Sometimes RDL is so congested that the capacity for routing is insufficient. Routing therefore cannot be completed within a single layer even for manual routing. Although [2] proposed a routing algorithm that uses two layers of RDLs, but in practice the required routing area is a little more than one layer. We overcome this problem by adopting the concept of pseudo single-layer. With the heuristics for routing on mapped channels and observations on staggered pins to relieve vertical constraints, the area of 2-layer routing can be minimized and the routability is 100%. Comparisons of routing results between manual design, the commercial tool, and the proposed method are presented. We have shown the effectiveness on a real industrial case: it originally required fully manual design, the proposed method can finish RDL routing automatically and effectively.

Original languageEnglish
Title of host publicationProceedings - Design, Automation and Test in Europe Conference and Exhibition, DATE 2012
Pages1597-1602
Number of pages6
DOIs
StatePublished - 24 May 2012
Event15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012 - Dresden, Germany
Duration: 12 Mar 201216 Mar 2012

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Conference

Conference15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012
CountryGermany
CityDresden
Period12/03/1216/03/12

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