Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure

N. Singh*, A. F. Bower, D. Gan, S. Yoon, P. S. Ho, Leu-Jih Perng, S. Shankar

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

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Physics & Astronomy