NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs

Yu-Min Lee, Tsung Heng Wu, Pei Yu Huang, Chi Ping Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.

Original languageEnglish
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2013
Pages1379-1384
Number of pages6
DOIs
StatePublished - 21 Oct 2013
Event16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013 - Grenoble, France
Duration: 18 Mar 201322 Mar 2013

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Conference

Conference16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013
CountryFrance
CityGrenoble
Period18/03/1322/03/13

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  • Cite this

    Lee, Y-M., Wu, T. H., Huang, P. Y., & Yang, C. P. (2013). NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs. In Proceedings - Design, Automation and Test in Europe, DATE 2013 (pp. 1379-1384). [6513728] (Proceedings -Design, Automation and Test in Europe, DATE). https://doi.org/10.7873/DATE.2013.282