Novel siloxane-modified epoxy resins as promising encapsulant for LEDs

Chih Hao Lin, Wha Tzong Whang, Chun-Hua Chen*, Shu Chen Huang, Kai Chi Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

This study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.

Original languageEnglish
Article number21
JournalPolymers
Volume12
Issue number1
DOIs
StatePublished - 1 Jan 2020

Keywords

  • Crosslinking density
  • Encapsulant
  • Siloxane-modified epoxy
  • Sulfurization resistance
  • Surface mounted device LEDs

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