Novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance

Kow-Ming Chang, I. Chung Deng, Yao Pin Tsai, Chan Yang Wen, Sy Jer Yeh, Shih Wei Wang, Jin Yea Wang

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

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Chemical Compounds

Engineering & Materials Science