Novel positive-tone thick photoresist for high aspect ratio microsystem technology

Chien-Wen Hsieh, Y. S. Hsieh, C. R. Yang, Y. D. Lee*

*Corresponding author for this work

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.

Original languageEnglish
Pages (from-to)326-329
Number of pages4
JournalMicrosystem Technologies
Volume8
Issue number4-5
DOIs
StatePublished - 1 Aug 2002

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