Novel pore-sealing technology in the preparation of low-k underfill materials for RF applications

Kuo Yuan Hsu*, Leu-Jih Perng

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Underfill materials had been widely employed in the flipchip packaging to fill the gaps of solder bumps connecting IC chip and organic substrate in order to prevent failure of the solder joints. For radio-frequency (RF) device applications, underfill materials should possess low dielectric constant to alleviate power loss at high-frequency, in addition to good thermal and mechanical properties. In this study, a novel approach of incorporating porosity through porous silica filler was attempted to develop low-k underfill materials. An inorganic, sacrificial material, hexamethylcyclotrisiloxane (D3), was used to temporarily seal the interconnected pores in the porous silica at temperature < 95°C by thermal and solvent pretreatment methods, and was later removed thermally at 125-165°C during the crosslinking reaction of underfill materials. For underfill materials with 15% filler content, a 7.8% reduction in dielectric constant has been successfully demonstrated and achieved by pore sealing of porous silica (60% porosity) using solvent pretreatment, while maintaining the mechanical strength of porous silica, 2.6 GPa. Moreover, the adhesion between epoxy and porous silica in the underfull materials was found to critical in preserving its mechanical strength when pore sealing pretreatment was applied.

Original languageEnglish
Title of host publicationProceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
DOIs
StatePublished - 2 Oct 2008
Event2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 - Pudong, Shanghai, China
Duration: 28 Jul 200831 Jul 2008

Publication series

NameProceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Conference

Conference2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
CountryChina
CityPudong, Shanghai
Period28/07/0831/07/08

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