Novel high isolation interconnect for broadband mixed signal silicon MMICs

Y. Qian*, Mau-Chung Chang, T. Itoh

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

A novel interconnect and packaging concept for high-density, broadband mixed signal silicon MMICs is presented. Compared to conventional microstrip or stripline-based structures, the proposed Silicon/Metal/Polyimide (SIMPOL) interconnect is very promising to achieve extremely high isolation (>100 dB) between adjacent channels from DC up to 50 GHz, as indicated by simulations using a pre-verified full-wave FDTD code.

Original languageEnglish
Pages79-82
Number of pages4
DOIs
StatePublished - 1 Dec 1998
EventProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA
Duration: 26 Oct 199828 Oct 1998

Conference

ConferenceProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
CityWest Point, NY, USA
Period26/10/9828/10/98

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