A novel interconnect and packaging concept for high-density, broadband mixed signal silicon MMICs is presented. Compared to conventional microstrip or stripline-based structures, the proposed Silicon/Metal/Polyimide (SIMPOL) interconnect is very promising to achieve extremely high isolation (>100 dB) between adjacent channels from DC up to 50 GHz, as indicated by simulations using a pre-verified full-wave FDTD code.
|Number of pages||4|
|State||Published - 1 Dec 1998|
|Event||Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA|
Duration: 26 Oct 1998 → 28 Oct 1998
|Conference||Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging|
|City||West Point, NY, USA|
|Period||26/10/98 → 28/10/98|