Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam

Tao Chi Liu, Chih Chen, Kuo Jung Chiu, Han Wen Lin, Jui Chao Kuo*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.

Original languageEnglish
Pages (from-to)42-48
Number of pages7
JournalMaterials Characterization
Volume74
DOIs
StatePublished - 1 Dec 2012

Keywords

  • Electron backscatter diffraction (EBSD)
  • Focused ion beam (FIB)
  • Image quality
  • Intermetallic compound
  • Sample preparation

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