Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer

Sheng Feng Lin, Cheng-Huan Chen, Cheng Yao Lo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.

Original languageEnglish
Title of host publication2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages77-81
Number of pages5
ISBN (Electronic)9781509003327
DOIs
StatePublished - 30 Nov 2015
Event21st IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2015 - Brasov, Romania
Duration: 22 Oct 201525 Oct 2015

Publication series

Name2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015

Conference

Conference21st IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2015
CountryRomania
CityBrasov
Period22/10/1525/10/15

Keywords

  • copper/low-k wafer
  • nondestructive optical inspection
  • scattering
  • sidewall crack

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    Lin, S. F., Chen, C-H., & Lo, C. Y. (2015). Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer. In 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015 (pp. 77-81). [7342299] (2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SIITME.2015.7342299