Nickel nano-composite film for MEMS applications

Kwok Siong Teh*, Yu-Ting Cheng, Liwei Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

Abstract

We have successfully demonstrated low-temperature, stress-free, wafer-level fabrication of nano-composite MEMS via both an electroless nickel (EN) and an electrolytic nickel (EL) deposition process, with the addition of uniformly dispersed nanoparticles of either cordierite (diameter ≈100 nm∼5 μm) or diamond (diameter ∼4 nm). The as-deposited nickel-cordierite films exhibit better thermal compatibility with Si, compared to nickel. The measured coefficient of thermal expansion (CTE) of EN-cordierite and EN is 17.34 ppm/K and 26.69 ppm/K, respectively. Stress-temperature measurement of EN-cordierite composite also confirms that residual stress decreases with the incorporations of cordierite. Finally, by adding various concentrations of nanodiamond particles into an EL matrix, it is found that higher diamond concentrations render the film to be more compressively stressed.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1534-1537
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
StatePublished - 1 Jan 2003
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 8 Jun 200312 Jun 2003

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume2

Conference

Conference12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period8/06/0312/06/03

Keywords

  • Circuits
  • Costs
  • Fabrication
  • Microcavities
  • Micromechanical devices
  • Nanoparticles
  • Nickel
  • Semiconductor films
  • Substrates
  • Temperature

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