Necking of low-bump-height solder induced by reactive wetting of solder on Au finishes in print circuit board

Chih Chia Hu, Khew Woei Haw, Chun Yi Wu, Chih Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report a necking reliability issue in low-bump-height solder induced by reactive wetting of solder on Au finish in print circuit board. During reflow and solid state aging, the solders diffused to the Au finishes on the print circuit boards and reacted with Au to from Au-Sn compounds. Because the solder volume is very limited, this reaction took a lot of percentage of solders and caused necking of the solder joints. On the other hand, the joints without the Au layers have less necking problem. The necking will have detrimental effect on the mechanical properties of the solder joints. Therefore, it will be a serious reliability issue for flip-chip solder joints with low bump heights and microbumps in 3D IC.

Original languageEnglish
Title of host publication2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud
Subtitle of host publicationCreating Value and Toward Eco-Life, IMPACT 2013 - Proceedings
Pages136-139
Number of pages4
DOIs
StatePublished - 1 Dec 2013
Event2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Taipei, Taiwan
Duration: 22 Oct 201325 Oct 2013

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013
CountryTaiwan
CityTaipei
Period22/10/1325/10/13

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  • Cite this

    Hu, C. C., Haw, K. W., Wu, C. Y., & Chen, C. (2013). Necking of low-bump-height solder induced by reactive wetting of solder on Au finishes in print circuit board. In 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings (pp. 136-139). [6706683] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2013.6706683