Natural convection heat transfer from square pin fin heat sinks subject to the influence of orientation

Ren Tsung Huang*, Wen Junn Sheu, Hsing Yung Li, Chi-Chuan Wang, Kai Shing Yang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Scopus citations

Abstract

An experimental study is conducted on natural convection heat transfer from square pin fin heat sinks subject to the influence of orientation. A total of six pin fin heat sinks with various arrangements are tested under controlled environment. Test results show that the upward facing orientation yields the highest heat transfer coefficient, followed by the sideward facing and the downward facing ones. The heat transfer coefficients for upward facing are about 0% ∼ 5% greater than those for sideward facing and are 0% ∼ 20% greater than those for downward facing. Besides, the effect of orientation becomes less pronounced as the population density is gradually increased. It is also found that the heat transfer coefficient reveals a maximum at a fin height nearby 2 mm or at a fin density of 1 pin/cm2. The effect of fin height and fin density can be termed as a composite parameter, namely the finning factor which represents the ratio of total surface to the base surface. The heat transfer coefficient initially increases with the finning factor, attains a maximum around 1.6-1.7, and then decreases. Although the heat sinks may not necessarily surpass the un-finned base plate in the heat transfer coefficient, the heat sinks still yield smaller convection resistances than the un-finned base plate.

Original languageEnglish
Title of host publicationTwenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006
Pages102-107
Number of pages6
DOIs
StatePublished - 24 Oct 2006
Event22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006 - Dallas, TX, United States
Duration: 14 Mar 200616 Mar 2006

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume2006
ISSN (Print)1065-2221

Conference

Conference22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006
CountryUnited States
CityDallas, TX
Period14/03/0616/03/06

Keywords

  • Electronic cooling
  • Natural convection
  • Orientation effect
  • Square pin fin heat sinks

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