NaPer: A TSV Noise-Aware Placer

Yu-Min Lee, Kuan Te Pan, Chun Chen

Research output: Contribution to journalArticlepeer-review


Through-silicon-via (TSV)-to-TSV coupling issue can degrade the signal integrity in 3-D integrated circuit designs. This paper develops a 3-D partitioning-based force-directed placer, NaPer, to reduce the total coupling noise between TSVs and alleviate the maximum coupling noise between them. We introduce two denoise forces: TSV decoupling force and TSV density force. The TSV decoupling force is determined by the coupling noise between TSVs for separating strong coupling TSVs, and the TSV density force is determined by the TSV density for evenly distributing TSVs. The experimental results show that NaPer can effectively reduce 15.0% total TSV coupling noise and 42.7% maximum TSV coupling noise on average with only 4.5% wirelength overhead. Besides, NaPer also shows great performance in wirelength that is competitive to the state-of-the-art 3-D placer.

Original languageEnglish
Article number7822965
Pages (from-to)1703-1713
Number of pages11
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number5
StatePublished - 1 May 2017


  • Coupling aware
  • layout
  • physical design
  • placement
  • three-dimensional integrated circuits
  • through-silicon via (TSV) coupling

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