Multiband RF-interconnect for CMP inter-core communications

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we propose a novel on-chip global interconnect that would meet stringent challenges of core-to-core communications in data rate (up to lOOGbps/link), latency and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitations of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are addressed as well.

Original languageEnglish
Title of host publicationICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
Pages1811-1814
Number of pages4
DOIs
StatePublished - 1 Dec 2008
Event2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing, China
Duration: 20 Oct 200823 Oct 2008

Publication series

NameInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Conference

Conference2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
CountryChina
CityBeijing
Period20/10/0823/10/08

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  • Cite this

    Chang, M-C. (2008). Multiband RF-interconnect for CMP inter-core communications. In ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings (pp. 1811-1814). [4734915] (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT). https://doi.org/10.1109/ICSICT.2008.4734915