Multi-Mode VCSEL Chip with High-Indium-Density InGaAs/AlGaAs Quantum-Well Pairs for QAM-OFDM in Multi-Mode Fiber

Cheng Ting Tsai, Chun Yen Peng, Chun Yen Wu, Shan Fong Leong, Hsuan Yun Kao, Huai Yung Wang, You Wei Chen, Zu Kai Weng, Yu Chieh Chi, Hao-Chung Kuo, Jian Jang Huang, Tai Cheng Lee, Tien Tsorng Shih, Jau Ji Jou, Wood Hi Cheng, Chao Hsin Wu, Gong Ru Lin*

*Corresponding author for this work

Research output: Contribution to journalArticle

18 Scopus citations

Abstract

An 850-nm multi-mode vertical cavity surface emitting laser (VCSEL) bare chip with high-indium-density InGaAs/AlGaAs quantum-well pairs is demonstrated for directly encoded QAM-OFDM transmission in multi-mode fiber (MMF). By directly encoding the 850-nm VCSEL bare chip with a pre-leveled 14-GHz 16-QAM OFDM data, >50-Gb/s transmission over 100-m-long OM4 MMF can be realized without using data recovery circuit. Increasing the bias current of the VCSEL beyond 7.5Ith improves the signal-to-noise ratio (SNR) and the bit error ratio (BER) of received QAM-OFDM data to 15.5 dB and 2.9 × 10-3, respectively. The 100-m-long OM4 MMF transmission degrades the SNR with its covered bandwidth reducing to 13 GHz. The OFDM subcarrier pre-leveling technique with a slope of 0.2 dB/GHz ensures the 16-QAM-OFDM data transmission with an error vector magnitude of 17.1% and a BER of 3.4 × 10-3.

Original languageEnglish
Article number7926398
JournalIEEE Journal of Quantum Electronics
Volume53
Issue number4
DOIs
StatePublished - 1 Aug 2017

Keywords

  • Vertical cavity surface emitting lasers
  • fiber optics
  • infrared
  • optical interconnects

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    Tsai, C. T., Peng, C. Y., Wu, C. Y., Leong, S. F., Kao, H. Y., Wang, H. Y., Chen, Y. W., Weng, Z. K., Chi, Y. C., Kuo, H-C., Huang, J. J., Lee, T. C., Shih, T. T., Jou, J. J., Cheng, W. H., Wu, C. H., & Lin, G. R. (2017). Multi-Mode VCSEL Chip with High-Indium-Density InGaAs/AlGaAs Quantum-Well Pairs for QAM-OFDM in Multi-Mode Fiber. IEEE Journal of Quantum Electronics, 53(4), [7926398]. https://doi.org/10.1109/JQE.2017.2703645