Multi-layer adaptive power management architecture for TSV 3DIC applications

Ming Hung Chang, Wei Chih Hsieh, Pei Chen Wu, Ching Te Chuang, Kuan-Neng Chen, Chen Chao Wang, Chun Yen Ting, Kua Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Wei Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In this work, a multi-layer hierarchical distributed power delivery architecture for TSV 3DIC is proposed. By decoupling global and local power networks, the proposed power delivery architecture can be flexibly configured for different power requests. The decoupled power architectures can also greatly reduce the required decoupling capacitor sizes for voltage stabilization. Meanwhile, a multi-threshold CMOS switched capacitor DC-DC converter with up to 78% power efficiency is implemented in 65nm CMOS for hierarchical distributed power delivery architecture. An adaptive power management technique is presented to work in the local power network to increase the power efficiency. The proposed multi-layer hierarchical distributed power delivery architecture is also very useful for the heterogeneous integration in 3DIC chips.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages1179-1185
Number of pages7
DOIs
StatePublished - 9 Sep 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 28 May 201331 May 2013

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period28/05/1331/05/13

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