Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices

Hsuan Hsuan Hsiao, Hong Wen Chiou, Yu-Min Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.

Original languageEnglish
Title of host publicationASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages70-75
Number of pages6
ISBN (Electronic)9781450360074
DOIs
StatePublished - 21 Jan 2019
Event24th Asia and South Pacific Design Automation Conference, ASPDAC 2019 - Tokyo, Japan
Duration: 21 Jan 201924 Jan 2019

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
CountryJapan
CityTokyo
Period21/01/1924/01/19

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