Motion of W marker during sequential compound formation in bimetallic AlCu thin films

H. T.G. Hentzell*, R. D. Thompson, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticle

6 Scopus citations

Abstract

Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse.

Original languageEnglish
Pages (from-to)81-84
Number of pages4
JournalMaterials Letters
Volume2
Issue number2
DOIs
StatePublished - 1 Jan 1983

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