The growth and size distribution of scallop-type Cu 6Sn 5 intermetallic compound (IMC) at the interface between molten SnPb solder and Cu was investigated, along with a systematic study of morphology change of Cu 6Sn 5 morphology change as a function of SnPb solder composition. When SnPb solder composition was changed from eutectic (63Sn37Pb) to about 40Sn60Pb, CueSn5 with round scallop-type morphology was found. In other compositions, the Cu 6Sn 5 scallops showed faceted scallop-type morphology. This morphological change is due to variation of interfacial energy between Cu 6Sn 5 and solder with a change of solder composition. The growth rate of Cu 6Sn 5 layer was proportional to cube root of time, and size distribution was in good agreement with the Flux-Driven-Ripening (FOR) theory. The pre-exponent factor k obtained by the measurement was 2.10×10 -4 cm 3/sec. Based on the k value, the calculated channel width with was about 2 nm, which was in good agreement with experimental observation by transmission electron microscopy.
|Number of pages||6|
|Journal||Materials Research Society Symposium Proceedings|
|State||Published - 19 Dec 2005|
|Event||2005 Materials Research Society Spring Meeting - San Francisco, CA, United States|
Duration: 28 Mar 2005 → 1 Apr 2005