Monolithic integration of digital MEMS thermometer and temperature compensated RTC on 1P6M ASIC compatible CMOS MEMS process

Ching Wen Hsu, Kuei-Ann Wen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

A monolithic resonator based digital MEMS thermometer has been proposed. It is further integrated with Real time clock (RTC) to demonstrate multifunction design as thermometer and temperature compensation. The MEMS/ASIC combined SOC is fabricated on UMC 0.18μm 1P6M ASIC compatible CMOS MEMS process. The resonant frequency of thermometer has been simulated with sensitivity-18Hz/°C. The temperature dependency of RTC frequency is 13.15(ppm/°C) in a temperature range from 20 °C to 80 °C. Power consumption of the readout circuit is 440.3μW.

Original languageEnglish
Title of host publication2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-48
Number of pages4
ISBN (Electronic)9781538652831
DOIs
StatePublished - 3 Oct 2018
Event13th IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Kuala Lumpur, Malaysia
Duration: 15 Aug 201817 Aug 2018

Publication series

NameIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Volume2018-August

Conference

Conference13th IEEE International Conference on Semiconductor Electronics, ICSE 2018
CountryMalaysia
CityKuala Lumpur
Period15/08/1817/08/18

Keywords

  • calibration
  • MEMS resonator
  • RTC
  • thermometer

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    Hsu, C. W., & Wen, K-A. (2018). Monolithic integration of digital MEMS thermometer and temperature compensated RTC on 1P6M ASIC compatible CMOS MEMS process. In 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings (pp. 45-48). [8481316] (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE; Vol. 2018-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2018.8481316