MOEMS Vibration Sensor with Organic Semiconductor Readout

A. Kainz*, W. Hortschitz, H. Steiner, Yi Hong Hong, Chao Hsuan Chen, Hsiao-Wen Zan, Hsin-Fei Meng, T. Sauter, F. Keplinger

*Corresponding author for this work

Research output: Contribution to journalConference article

1 Scopus citations

Abstract

We present a first proof of principle of applying organic semiconductors as key components in micro-mechanical vibration sensors. The mechanical part of the MOEMS sensor readout is etched into the device layer of an SOI chip and consists of a laterally deflecting inertial mass that features a two-dimensional grid of rectangular holes. An identical grid is evaporated onto a glass chip bonded onto the silicon chip in such way that any deflection of the seismic mass will modulate the light flux passing through the device. The light flux is provided in this case by an OLED and detected by an OPD. It is shown with a proof of concept device that for such sensors organic optoelectronics can replace inorganic ones, which is the starting point for developing a variety of MOEMS sensors based on printed optoelectronic devices.

Original languageEnglish
Pages (from-to)1253-1256
Number of pages4
JournalProcedia Engineering
Volume168
DOIs
StatePublished - 1 Jan 2016
Event30th Eurosensors Conference, Eurosensors 2016 - Budapest, Hungary
Duration: 4 Sep 20167 Sep 2016

Keywords

  • MEMS
  • MOEMS
  • OLED
  • OPD
  • Vibration Sensors

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    Kainz, A., Hortschitz, W., Steiner, H., Hong, Y. H., Chen, C. H., Zan, H-W., Meng, H-F., Sauter, T., & Keplinger, F. (2016). MOEMS Vibration Sensor with Organic Semiconductor Readout. Procedia Engineering, 168, 1253-1256. https://doi.org/10.1016/j.proeng.2016.11.439