Minimizing the total machine workload for the wafer probing scheduling problem

W.l. Pearn*, S. H. Chung, M. H. Yang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The Wafer Probing Scheduling Problem (WPSP) is a practical generalization of the parallel-machine scheduling problem, which has many real-world applications, particularly, in the Integrated Circuit (IC) manufacturing industry. In the wafer probing factories, the jobs are clustered by their product types, which must be processed on groups of identical parallel machines and be completed before the due dates. The job processing time depends on the product type, and the machine setup time is sequentially dependent on the orders of jobs processed. Since the wafer probing scheduling problem involves constraints on job clusters, job-cluster dependent processing time, due dates, machine capacity, and sequentially dependent setup time, it is more difficult to solve than the classical parallel-machine scheduling problem. In this paper, we consider the WPSP and formulate the WPSP as an integer programming problem to minimize the total machine workload. We demonstrate the applicability of the integer programming model by solving a real-world example taken from a wafer probing shop floor in an IC manufacturing factory.

Original languageEnglish
Pages (from-to)211-220
Number of pages10
JournalIIE Transactions (Institute of Industrial Engineers)
Volume34
Issue number2
DOIs
StatePublished - 1 Jan 2002

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