Microstructure evolution and abnormal grain growth during copper wafer bonding

Kuan-Neng Chen*, A. Fan, C. S. Tan, R. Reif, Y. Wen

*Corresponding author for this work

Research output: Contribution to journalArticle

80 Scopus citations

Abstract

The evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing was studied. Transmission electron microscopy (TEM), electron diffraction and X-ray diffraction (XRD) was used in the study. Anealing after bonding effectively improved the bond strength and the grain structure was saturated at this time.

Original languageEnglish
Pages (from-to)3774-3776
Number of pages3
JournalApplied Physics Letters
Volume81
Issue number20
DOIs
StatePublished - 11 Nov 2002

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