Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu*, Chih Chen, C. N. Liao, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticle

167 Scopus citations

Abstract

Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

Original languageEnglish
Pages (from-to)58-60
Number of pages3
JournalApplied Physics Letters
Volume75
Issue number1
DOIs
StatePublished - 5 Jul 1999

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