Microchannel cooling of traveling-wave-tube circuit for ultrawideband high-power submillimeter-wave generation

Yanbao Ma*, Avijit Bhunia, Mark Field, Chung-Lung Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

High heat dissipation is generated in Traveling-wave-tube circuit for ultrawideband high-power submillimeter-wave generation due to e-beam power loss during transport. Active cooling is required to ensure the device can physically handle the high heat flux without damage. An efficient thermal management solution is provided for cooling the high-power vacuum device based on microchannel technology. A thermal conduction model is developed in Ansys Workbench® to calculate thermal resistance in the vacuum device while a conjugated thermal conduction and convection model is developed in Fluent® for the design of microchannel heat sink. The performance of microchannel heat sink is investigated to ensure a safe operational condition (maximum temperature≤ 250°C) for the high-power vacuum device with 95% e-beam transport efficiency.

Original languageEnglish
Title of host publication2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Pages463-468
Number of pages6
DOIs
StatePublished - 29 Nov 2010
Event5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
Duration: 20 Jan 201023 Jan 2010

Publication series

Name2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Conference

Conference5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
CountryChina
CityXiamen
Period20/01/1023/01/10

Keywords

  • Heat sink
  • High frequency vacuum electronics
  • Microchannel cooling
  • Microfluidic
  • Numerical simulation

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