Micro-lens array design on a flexible light-emitting diode package for indoor lighting

Hsiao Wen Lee*, Bor-Shyh Lin

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

An advanced, ultra-thin, flexible LED (FLED) package technique is first proposed in this study, where a polyimide substrate was used as the lead frame package material due to its physical stability in thermal processing. The experimental results showed that the thickness of the mockup sample measured by a vernier caliper was 260 μm and 35% thinner than the Panasonic organic LED lighting panel announced on 4 March 2014 in Tokyo. Moreover, the flexible angle of the ultra-thin LED package was 200.54° when it surrounded a disk with a 1 cm radius. A design of a micro-lens array manufactured by silicone molding on the FLED is also proposed in this study. Finally, different types of micro-lenses were applied to different lighting regions to investigate their lighting effects.

Original languageEnglish
Pages (from-to)E210-E215
JournalApplied Optics
Volume54
Issue number28
DOIs
StatePublished - 1 Oct 2015

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