Methodology to evaluate the robustness of integrated circuits under Cable Discharge Event

Tai Xiang Lai*, Ming Dou Ker

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Cable Discharge Event (CDE) has been the main cause which damages the Ethernet interface. The transmission line pulsing (TLP) system has been the most important method to observe electric characteristics of the device under human-body-model (HBM) ESD stress. In this work, the long-pulse transmission line pulsing (LP-TLP) system is proposed to simulate the influence of CDE on the Ethernet integrated circuits, and the results are compared with conventional 100-ns TLP system. The experimental results have shown that the CDE robustness of NMOS device in a 0.25-μm CMOS technology is much worse than its HBM electrostatic discharge robustness.

Original languageEnglish
Title of host publication2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages499-502
Number of pages4
ISBN (Print)0780393392, 9780780393394
DOIs
StatePublished - 1 Jan 2005
Event2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC - Howloon, Hong Kong
Duration: 19 Dec 200521 Dec 2005

Publication series

Name2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC

Conference

Conference2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC
CountryHong Kong
CityHowloon
Period19/12/0521/12/05

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    Lai, T. X., & Ker, M. D. (2005). Methodology to evaluate the robustness of integrated circuits under Cable Discharge Event. In 2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC (pp. 499-502). [1635317] (2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDSSC.2005.1635317