Method on surface roughness modification to alleviate stiction of microstructures

Cheng Chang Lee*, Wen-Syang Hsu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

The methods on surface roughness modification to alleviate stiction of microstructures was discussed. Two kinds of surface roughness modification processes: spin-on photoresist and RIE process, were presented. The principle was based on an uneven etch of the photoresist by RIE, where the photoresist acted as the transferring template. It was found out that the modification process did not have to change the original fabrication process of the device and no extra mask was needed.

Original languageEnglish
Pages (from-to)1505-1510
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume21
Issue number4
DOIs
StatePublished - 1 Jul 2003

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