The methods on surface roughness modification to alleviate stiction of microstructures was discussed. Two kinds of surface roughness modification processes: spin-on photoresist and RIE process, were presented. The principle was based on an uneven etch of the photoresist by RIE, where the photoresist acted as the transferring template. It was found out that the modification process did not have to change the original fabrication process of the device and no extra mask was needed.
|Number of pages||6|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - 1 Jul 2003|