Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

D. W. Zheng; Y. H. Xu; Y. P. Tsai; King-Ning Tu; P. Patterson; Bin Zhao; Q. Z. Liu; Maureen Brongo

doi:10.1063/1.126237

Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

D. W. Zheng^*, Y. H. Xu, Y. P. Tsai, King-Ning Tu, P. Patterson, Bin Zhao, Q. Z. Liu, Maureen Brongo

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Article › peer-review

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Abstract

We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm². The Si membrane was subsequently removed in a pulsed XeF₂ etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively.

Original language	English
Pages (from-to)	2008-2010
Number of pages	3
Journal	Applied Physics Letters
Volume	76
Issue number	15
DOIs	https://doi.org/10.1063/1.126237
State	Published - 10 Apr 2000

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title = "Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method",

abstract = "We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively.",

author = "Zheng, {D. W.} and Xu, {Y. H.} and Tsai, {Y. P.} and King-Ning Tu and P. Patterson and Bin Zhao and Liu, {Q. Z.} and Maureen Brongo",

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T1 - Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

AU - Zheng, D. W.

AU - Xu, Y. H.

AU - Tsai, Y. P.

AU - Tu, King-Ning

AU - Patterson, P.

AU - Zhao, Bin

AU - Liu, Q. Z.

AU - Brongo, Maureen

PY - 2000/4/10

Y1 - 2000/4/10

N2 - We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively.

AB - We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively.

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JF - Applied Physics Letters

SN - 0003-6951

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Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

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