Measurement of mechanical properties for dense and porous polymer films having a low dielectric constant

Yuhuan Xu*, Yipin Tsai, D. W. Zheng, King-Ning Tu, Chung Wo Ong, Chung Loong Choy, Bin Zhao, Q. Z. Liu, Maureen Brongo

*Corresponding author for this work

Research output: Contribution to journalArticle

14 Scopus citations

Abstract

We measured the mechanical properties of dense and porous polymeric films, the modified polyarylethers, which have a low dielectric constant varying from 2.7 to 1.8, by combining three different methods; membrane bulge test, nanoindentation, and single-substrate bending beam method. The elastic modulus and initial stress measured from these three methods are in good agreement. The substrate effect was observed in the measurements by nanoindentation. Data obtained by nanoindentation show a significant dependence on the film thickness and the displacement depth of the indenter. However, the hardness of the low dielectric constant thin film does not depend on thickness and only slightly depends on the indentation depth. A tentative analysis is proposed to explain the results.

Original languageEnglish
Pages (from-to)5744-5750
Number of pages7
JournalJournal of Applied Physics
Volume88
Issue number10
DOIs
StatePublished - 15 Nov 2000

Fingerprint Dive into the research topics of 'Measurement of mechanical properties for dense and porous polymer films having a low dielectric constant'. Together they form a unique fingerprint.

  • Cite this

    Xu, Y., Tsai, Y., Zheng, D. W., Tu, K-N., Ong, C. W., Choy, C. L., Zhao, B., Liu, Q. Z., & Brongo, M. (2000). Measurement of mechanical properties for dense and porous polymer films having a low dielectric constant. Journal of Applied Physics, 88(10), 5744-5750. https://doi.org/10.1063/1.1287756