Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test

Chien Chang Chen*, Wei Chen Wu, Ching Yu Chin, Hung-Ming Chen, Vito Lin, Eason Chen

*Corresponding author for this work

Research output: Contribution to conferencePaper

Abstract

By employing the physical characteristics of creep deformation mechanisms for solder joints in a flip-chip ball grid array (FCBGA) package under a thermal cyclic condition, an analytical model for the prediction of mean-time-to-crack (MTTC) is presented in the paper. With the consideration of time-dependent thermal testing functionals, the basic co-analyses of one-cycle Nabarro-Herring and Coble creep rates and the corresponding damage accumulation functionals for the conventional eutectic Sn/Pb micro-solder material are studied using the proposed MTTC model theoretically. For experimentally validation of the MTTC model, a batch of devices filled with resin in FCGBA package had been tested under a -40°C∼125°C thermal cyclic test with a period of 1-hour 1000 times. The MTTC model reveals that the solder bumps within the FCGBA can survive about 0.53 year under the cyclic testing circumstance. Under the room temperature, the device even can survive about 2.45 years under continuously operations.

Original languageEnglish
Pages104-109
Number of pages6
DOIs
StatePublished - 1 Jan 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: 25 Sep 201327 Sep 2013

Conference

Conference19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period25/09/1327/09/13

Fingerprint Dive into the research topics of 'Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test'. Together they form a unique fingerprint.

  • Cite this

    Chen, C. C., Wu, W. C., Chin, C. Y., Chen, H-M., Lin, V., & Chen, E. (2013). Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test. 104-109. Paper presented at 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany. https://doi.org/10.1109/THERMINIC.2013.6675215