We demonstrate a low threshold voltage (V t ) of -0.17 V and good hole mobility (54 cm 2 /V · s at 0.8 MV/cm) in TaN/ Ir/LaTiO p-MOSFETs at an equivalent oxide thickness of only 0.66 nm. This was achieved by using Ni-induced solid-phase diffusion of SiO 2 -covered Ni/Ga which reduced the high-κ dielectric interfacial reactions. This approach, along with its self-aligned and gate-first process, is compatible with current VLSI technology.
- Low V
- Solid-phase diffusion (SPD)