In this work, gold is utilized as a thin film material to achieve low-Temperature thermocompression bonding (TCB) at 100°C. The gold thin film can reduce the copper bonding temperature and avoid the formation of intermetallic compounds (IMCs). Additionally, gold has a lower hardness compared to copper, and surface roughness can be reduced with a gold thin film on the copper. Gold layer has high chemical stability and can protect the redistribution layer (RDL) from oxidation. These properties are helpful during the TCB process. Furthermore, based on the several performance tests, gold can provide a reliable bonding structure.