Low-temperature direct CVD oxides to thermal oxide wafer bonding in silicon layer transfer

C. S. Tan*, Kuan-Neng Chen, A. Fan, R. Reif

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Fingerprint Dive into the research topics of 'Low-temperature direct CVD oxides to thermal oxide wafer bonding in silicon layer transfer'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy