Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly -orientated Nanotwinned Cu Films

Fu Chian Chen*, Yu Ting Wu, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, we capped gold on the surface of highly (111)- orientated nano-twin copper films. With the great diffusivity of (111) copper and the low activity in gold, we can achieve a lower bonding temperature.

Original languageEnglish
Title of host publication2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages51-51
Number of pages1
ISBN (Electronic)9784904743072
DOIs
StatePublished - May 2019
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 21 May 201925 May 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period21/05/1925/05/19

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